Flip-chip-on-board (FCOB) assembly and reliability

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1997, Pages 32-36

  Yegnasubramanian, S ^a   Deshmukh, R ^a   Fulton, J ^a   Fanucci, R ^a   Gannon, J ^a   Morris, J R ^a   Nikmanesh, Khalil ^a  

^a NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY MACHINES; FAILURE ANALYSIS; PRINTED CIRCUIT MANUFACTURE; RELIABILITY; SURFACE MOUNT TECHNOLOGY; THERMAL STRESS;

DIRECT CHIP ATTACHMENT (DCA); FLIP CHIP ON BOARD (FCOB) ASSEMBLY;

FLIP CHIP DEVICES;

EID: 0031377571     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)