Isothermal versus standard wafer electromigration test for the characterization of metal systems

International Integrated Reliability Workshop Final Report

Volumn , Issue , 1997, Pages 136-137

  Brisbin, Dougas ^a   Turner, Timothy ^a  

^a Keithley Instruments Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT DENSITY; FAILURE ANALYSIS; SEMICONDUCTOR DEVICE STRUCTURES; TEMPERATURE CONTROL;

BLACK EQUATION; ISOTHERMAL ELECTROMIGRATION TEST; MEAN TIME TO FAILURE;

ELECTROMIGRATION;

EID: 0031369621     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (1)