Thermal management of electronic packages using solid-to-liquid phase change techniques

Proceedings of the International Systems Packaging Symposium

Volumn , Issue , 1997, Pages 72-80

  O'Connor, John Patrick ^a   Weber, Richard M ^a  

^a RAYTHEON COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COOLING; ENERGY ABSORPTION; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; PHASE TRANSITIONS; SPECIFIC HEAT OF SOLIDS; TEMPERATURE CONTROL; THERMAL CONDUCTIVITY OF SOLIDS; WASTE HEAT;

ELECTRONIC THERMAL MANAGEMENT; PHASE CHANGE MATERIALS (PCM);

ELECTRONICS PACKAGING;

EID: 0031367862     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (21)