Interface of aluminum/ceramic power substrates manufactured by casting-bonding process

Materials Research Society Symposium - Proceedings

Volumn 445, Issue , 1997, Pages 101-106

  Ning, X S ^a   Ogawa, Y ^a   Suganuma, K ^a  

^a Dowa Metals and Mining Co Ltd   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; BONDING; CERAMIC MATERIALS; ETCHING; INTERFACES (MATERIALS); NICKEL PLATING; SUBSTRATES; THERMAL STRESS;

CASTING BONDING METHOD; POWER SUBSTRATES;

ELECTRONICS PACKAGING;

EID: 0031366223     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)