Designing to digital wireless specifications using circuit envelope simulation

Asia-Pacific Microwave Conference Proceedings, APMC

Volumn 1, Issue , 1997, Pages 173-176

  Yap, How Siang ^a  

^a HEWLETT PACKARD COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER AIDED NETWORK ANALYSIS; COMPUTER SIMULATION; PHASE LOCKED LOOPS; RADIO COMMUNICATION;

AMPLIFIER ADJACENT CHANNEL POWER RATIO (ACPR); CIRCUIT ENVELOPE TECHNOLOGY; ERROR VECTOR MAGNITUDE (EVM); NOISE POWER RATIO (NPR);

DIGITAL COMMUNICATION SYSTEMS;

EID: 0031363448     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)