Anisotropic patterning of copper-laminated polyimide foils by plasma etching

Surface and Coatings Technology

Volumn 97, Issue 1-3, 1997, Pages 481-487

  Richter, K ^a   Orfert, M ^a   Drescher, K ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Enisotropic patterning; Plasma etching; Polyimide foils; Polymer foils; Polymer patterning; Reactive ion etching

Indexed keywords

ANISOTROPY; CHEMICAL REACTIONS; COPPER; ION BOMBARDMENT; POLYIMIDES; SLOT ANTENNAS; SUBSTRATES; THERMAL STRESS;

COPPER LAMINATED POLYIMIDE FOILS; POLYMER PATTERNING; REACTIVE ION ETCHING (RIE);

PLASMA ETCHING;

EID: 0031363369     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(97)00209-0     Document Type: Article

References (4)

1. F.D. Egitto, V. Vukanovic, G.N. Taylor, in: R. d'Agostino (Ed.), Plasma Deposition, Treatment and Etching of Polymers, Plasma Etching of Organic Polymers, Academic Press, New York, 1990.
2. H. v. Boenig, Fundamentals of Plasma Chemistry and Technology, Plasma Etching of Organic Materials, Research Institute of Plasma Chemistry and Technology, Carlsbad, CA, 1988.
3. C.B. Zarowin, J. Vac. Sci. Technol. A2 (4), Oct-Dec (1984) 1537.
4. K. Richter, K. Drescher, Pyrometric substrate temperature measurement during plasma etching, Surf. Coat. Technol. 74/75 (1995) 546-551.