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Volumn 11, Issue 12, 1997, Pages
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Component packaging issues: BGA and CSP
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Author keywords
[No Author keywords available]
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Indexed keywords
PRINTED CIRCUIT BOARDS;
SURFACE MOUNT TECHNOLOGY;
BALL GRID ARRAYS (BGA);
CHIP SCALE PACKAGE (CSP);
ELECTRONICS PACKAGING;
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EID: 0031362998
PISSN: 08933588
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
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Times cited : (2)
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References (0)
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