Toughening of high performance epoxy adhesives using core-shell particles

American Society of Mechanical Engineers, Applied Mechanics Division, AMD

Volumn 222, Issue , 1997, Pages 163-166

  Sue, Hung Jue ^a   Puckett, P Mac ^b   Wang, Yee Y ^c  

^a Department of Electrical and Computer Engineering   (United States)

^b DOW CHEMICAL COMPANY   (United States)

^c Essex Specialty Products   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; EPOXY RESINS; FRACTURE MECHANICS; FRACTURE TOUGHNESS; PEELING; RUBBER; SHEAR STRENGTH; THERMOSETS; TOUGHENING;

CORE SHELL PARTICLE TECHNOLOGY; CORE SHELL RUBBER; PROCESSABILITY; SHEAR TEST;

ADHESIVES;

EID: 0031362621     PISSN: 01608835     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (13)

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