Cost issues for chip scale packaging

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1997, Pages 224-228

  Singer, Adam T ^a   Wzorek, Jay F ^a  

^a IBIS Associates Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COST ACCOUNTING; DECISION MAKING; INTEGRATED CIRCUIT LAYOUT;

CHIP SCALE PACKAGING (CSP);

ELECTRONICS PACKAGING;

EID: 0031362055     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)