Flip-chip photodetector for high-speed communications instrumentation

Hewlett-Packard Journal

Volumn 48, Issue 5, 1997, Pages 102-109

  Tan, Tun S ^a   Braun, David M ^a   Bagwell, Tim L ^a   Kocot, Christopher P ^a   Straznicky, Joseph ^a   Sloan, Susan R ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; COMPUTER SIMULATION; ELECTRON DEVICE MANUFACTURE; FLIP CHIP DEVICES; METALLORGANIC VAPOR PHASE EPITAXY; OPTICAL FIBER COUPLING; OPTICAL INTERCONNECTS; PHOTODIODES; PHOTORESISTS; SIGNAL RECEIVERS;

FLIP CHIP PHOTODETECTOR; ORGANOMETALLIC VAPOR PHASE EPITAXIAL SYSTEM; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;

PHOTODETECTORS;

EID: 0031361473     PISSN: 00181153     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (3)

1. O. Wada, "Ion Beam Etching of InP and Its Application to the Fabrication of High Radiance InGaAs/InP Light Emitting Diodes," Journal of the Electrochemical Society: Solid-State Science and Technology, October 1984.
2. B. Imler, K. Scholz, M. Cobarruviaz, R. Haitz, V.K. Nagesh, and C. Chao, "Precision Flip-Chip Solder Bump Interconnects for Optical Packaging," IEEE Electronic Components and Technology Conference, 1992.
3. T.S. Tan, R.L. Jungerman, and S.S. Elliott, "Optical Receiver and Modulator Frequency Response Measurement with a Nd:YAG Ring Laser Heterodyne Technique," IEEE Transactions on Microwave Theory and Techniques, Vol. MTT-30, 1989, pp. 1217-1222.