Advanced Image-Processing Techniques for Automatic Nondestructive Evaluation of Adhesively-Bonded Structures Using Speckle Interferometry

Journal of Nondestructive Evaluation

Volumn 16, Issue 4, 1997, Pages 215-227

  Fomitchov, Pavel ^a   Wang, Liu Sheng ^a   Krishnaswamy, Sridhar ^a  

^a Northwestern University   (United States)

Author keywords

Electronic speckle pattern interferometry; Fringe pattern analysis and interpretation; Quantitative nondestructive evaluation (QNDE); Shearography

Indexed keywords

DELAMINATION; IMAGE PROCESSING; INTERFEROMETRY; NONDESTRUCTIVE EXAMINATION; SHEAR DEFORMATION; SPECKLE;

SPECKLE INTERFEROMETRY;

ADHESIVE JOINTS;

EID: 0031361068     PISSN: 01959298     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1021848031529     Document Type: Review

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