-
1
-
-
84964140678
-
The End Problem for a Laminated Elastic Strip-II. Differential Expansion Stresses
-
Hess, M. S. 1969. "The End Problem for a Laminated Elastic Strip-II. Differential Expansion Stresses," J. Composite Mat., 3:630-641.
-
(1969)
J. Composite Mat.
, vol.3
, pp. 630-641
-
-
Hess, M.S.1
-
2
-
-
0017516991
-
Edge Effects on Thermally Induced Stresses in Composite Laminates
-
Wang, A. S. D. and F. W. Crossman. 1977. "Edge Effects on Thermally Induced Stresses in Composite Laminates," J. Composite Mat., 11:300-312.
-
(1977)
J. Composite Mat.
, vol.11
, pp. 300-312
-
-
Wang, A.S.D.1
Crossman, F.W.2
-
3
-
-
0039972857
-
Interlaminar Thermoelastic Stresses in Layered Beams
-
Grimado, P. B. 1978. "Interlaminar Thermoelastic Stresses in Layered Beams," J. Thermal Stresses, 1:75-86.
-
(1978)
J. Thermal Stresses
, vol.1
, pp. 75-86
-
-
Grimado, P.B.1
-
5
-
-
0021373399
-
Process-Induced Residual Thermal Stresses in Advanced Fiber-Reinforced Composite Laminates
-
Stango, R. J. and S. S. Wang. 1984. "Process-Induced Residual Thermal Stresses in Advanced Fiber-Reinforced Composite Laminates," ASME J Engrg. for Power, 106:48-54.
-
(1984)
ASME J Engrg. for Power
, vol.106
, pp. 48-54
-
-
Stango, R.J.1
Wang, S.S.2
-
6
-
-
0024478835
-
Hygrothermal Effects on the Stress Field of Laminated Composites
-
Bouadi, H. and C. T. Sun. 1989. "Hygrothermal Effects on the Stress Field of Laminated Composites," J. Reinforced Plastics & Composites, 8:40-54.
-
(1989)
J. Reinforced Plastics & Composites
, vol.8
, pp. 40-54
-
-
Bouadi, H.1
Sun, C.T.2
-
7
-
-
0024858752
-
Thermal Stress Analysis of Laminate Using Higher-Order Theory in Each Layer
-
Cho, K. N., A. G. Striz and C. W. Bert. 1989. "Thermal Stress Analysis of Laminate Using Higher-Order Theory in Each Layer," J. Thermal Stresses, 12:321-332.
-
(1989)
J. Thermal Stresses
, vol.12
, pp. 321-332
-
-
Cho, K.N.1
Striz, A.G.2
Bert, C.W.3
-
8
-
-
0024736944
-
Thermal Stresses at the Edge of a Bimetallic Thermostat
-
Kuo, A.-Y. and K.-L. Chen. 1989. "Thermal Stresses at the Edge of a Bimetallic Thermostat," ASME J. App. Mech., 56:585-589.
-
(1989)
ASME J. App. Mech.
, vol.56
, pp. 585-589
-
-
Kuo, A.-Y.1
Chen, K.-L.2
-
9
-
-
0006039445
-
Thermal Stresses in Compliantly-Joined Materials
-
Glaser, J. C. 1990. "Thermal Stresses in Compliantly-Joined Materials," ASME J. Electronic Packaging, 112:24-29.
-
(1990)
ASME J. Electronic Packaging
, vol.112
, pp. 24-29
-
-
Glaser, J.C.1
-
10
-
-
0026172299
-
Interfacial Shear and Peel Stresses in Multilayered Thin Stacks Subjected to Uniform Thermal Loading
-
Pao, Y.-H. and E. Eisele. 1991. "Interfacial Shear and Peel Stresses in Multilayered Thin Stacks Subjected to Uniform Thermal Loading," ASME J. Electronic Packaging, 113:164-172.
-
(1991)
ASME J. Electronic Packaging
, vol.113
, pp. 164-172
-
-
Pao, Y.-H.1
Eisele, E.2
-
11
-
-
5644290773
-
Free-Edge Effects in Laminates under Extension, Bending and Twisting, Part I: A Stress-Function Approach," and "Part II: Eigenfunction Analysis and the Results for Symmetric Laminates
-
Yin, W.-L. "Free-Edge Effects in Laminates under Extension, Bending and Twisting, Part I: A Stress-Function Approach," and "Part II: Eigenfunction Analysis and the Results for Symmetric Laminates," ASME J. Appl. Mech., 61:410-415 and pp. 416-421.
-
ASME J. Appl. Mech.
, vol.61
, pp. 410-415
-
-
Yin, W.-L.1
-
12
-
-
0041955297
-
Analysis of the Interlaminar Thermal Stresses in Anisotropic Multilayered Structure
-
J. Lau (ed.), Van Nostrand-Reinhold
-
Yin, W.-L. 1993. "Analysis of the Interlaminar Thermal Stresses in Anisotropic Multilayered Structure," in Thermal Stress and Strain in Microelectronic Packaging, J. Lau (ed.), Van Nostrand-Reinhold, pp. 95-138.
-
(1993)
Thermal Stress and Strain in Microelectronic Packaging
, pp. 95-138
-
-
Yin, W.-L.1
-
13
-
-
0026124354
-
Thermal Stresses and Free-Edge Effects in Laminated Beams: A Variational Approach Using Stress Functions
-
Yin, W.-L. 1991. "Thermal Stresses and Free-Edge Effects in Laminated Beams: A Variational Approach Using Stress Functions," ASME J. Electronic Packaging, 113:68-75.
-
(1991)
ASME J. Electronic Packaging
, vol.113
, pp. 68-75
-
-
Yin, W.-L.1
-
14
-
-
0342639557
-
Refined Variational Solutions of the Interfacial Thermal Stresses in a Laminated Beam
-
Yin, W.-L. 1992. "Refined Variational Solutions of the Interfacial Thermal Stresses in a Laminated Beam," ASME J. Electronic Packaging, 114:193-198.
-
(1992)
ASME J. Electronic Packaging
, vol.114
, pp. 193-198
-
-
Yin, W.-L.1
-
15
-
-
0028425128
-
Analysis of Bonding Problems under Thermal Loading Using the Combined Mixed Functional
-
Kim, D. S. and B. C. Lee. 1994. "Analysis of Bonding Problems under Thermal Loading Using the Combined Mixed Functional," Int. J. Solids Structures, 31:1225-1240.
-
(1994)
Int. J. Solids Structures
, vol.31
, pp. 1225-1240
-
-
Kim, D.S.1
Lee, B.C.2
-
20
-
-
0028445654
-
Interlaminar Stress Analysis of Composite Laminates Using a Sublaminate/Layer Model
-
Yin, W.-L. "Interlaminar Stress Analysis of Composite Laminates Using a Sublaminate/Layer Model," Int. J. Solids Structures, 31:1549-1564.
-
Int. J. Solids Structures
, vol.31
, pp. 1549-1564
-
-
Yin, W.-L.1
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