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Volumn 221, Issue 2-3, 1997, Pages 281-289

Copper as an additive in the As0.4Se0.3Te0.3 glass: Mean atomic volume and Tg

Author keywords

[No Author keywords available]

Indexed keywords

ADDITION REACTIONS; ADDITIVES; CHEMICAL MODIFICATION; COMPOSITION EFFECTS; COPPER; CROSSLINKING; GLASS TRANSITION; TEMPERATURE;

EID: 0031358129     PISSN: 00223093     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0022-3093(97)00336-0     Document Type: Article
Times cited : (15)

References (82)
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    • U.S. Department of Commerce, NBS and the Joint Committee on Powder Diffraction Studies
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    • (1973) Crystal Data Determination Tables , vol.2
    • Dannay, J.D.H.1    Ondik, H.M.2
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    • Cornell University, New York
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    • (1976) The Chemical Bond
    • Pauling, L.1
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    • 0003367964 scopus 로고
    • Chemical Bonds and Bond Energy
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    • R.T. Sanderson, in: E.M. Loebl (Ed.), Chemical Bonds and Bond Energy, Series of Monographs in Physical Chemistry, vol. 21, Academic Press, New York, 1976.
    • (1976) Series of Monographs in Physical Chemistry , vol.21
    • Sanderson, R.T.1
  • 73
  • 74
    • 0346671671 scopus 로고
    • Amorphous Semiconductors
    • K. Somogyi (Ed.), Hungary, 20-25 Sept.
    • V.I. Dotsenko, G.S. Yuryev, in: K. Somogyi (Ed.), Amorphous Semiconductors, Proc. Int. Conf. Balatonfured, Hungary, 20-25 Sept., 1976, p. 491.
    • (1976) Proc. Int. Conf. Balatonfured , pp. 491
    • Dotsenko, V.I.1    Yuryev, G.S.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.