SPICE electrothermal modeling of power integrated circuits

Proceedings of the International Conference on Microelectronics

Volumn 2, Issue , 1997, Pages 479-482

  Maxim, Adrian ^a   Andreu, Danielle ^a   Boucher, Jacques ^a  

^a GHEORGHE ASACHI TECHNICAL UNIVERSITY OF IASI   (Romania)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER AIDED NETWORK ANALYSIS; COMPUTER SIMULATION; EQUIVALENT CIRCUITS; SEMICONDUCTOR DEVICE MODELS; VLSI CIRCUITS;

ELECTROTHERMAL MACROMODELS; SOFTWARE PACKAGE SPICE;

POWER ELECTRONICS;

EID: 0031357109     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)