Eddy current flaw imaging using micro-sensor arrays

American Society of Mechanical Engineers, Tribology Division, TRIB

Volumn 7, Issue , 1997, Pages 13-18

  Xue, Jianhua ^a   Ramalingam, S ^a   Shi, Zheng ^a  

^a University of Minnesota   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPONENTS; CRACK INITIATION; DRY ETCHING; EDDY CURRENT TESTING; FATIGUE OF MATERIALS; INSPECTION; PHOTOLITHOGRAPHY; SILICON WAFERS; SUBSTRATES;

EDDY CURRENT FLAW IMAGING; FLAW DETECTION; KAPTON SUBSTRATES; MICROSENSORS; WET ETCHING;

SENSORS;

EID: 0031356985     PISSN: None     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (7)

1. Blitz, J, 1991, Electrical and Magnetic Methods of Non-destructive Testing, Adam Hilger, Bristol.
2. Dodd, C. V., 1967, Solutions to Electromagnetic Induction Problems, Ph.D. Dissertation, University of Tennessee, Knoxville, TN.
3. Dodd C. V., at al., 1995, Advancement In Eddy Current Test Technology For Steam Generator Tube Inspection, Materials Evaluation, 53(1), pp. 49-54.
4. Karlquist, O., 1954, Trans. Royal Inst. Technol., Stockholm, 88, pp. 3-12.
5. Libby, H. L., 1971, Introduction to Electromagnetic Non-destructive Testing Methods, Wiley-Interscience, New York, NY.
6. Uesaka, M., et al., 1995, IEEE Transactions on Magnetics, 31, pp. 870 - 876.
7. Zheng, L., Xue, J and Ramalingam, S., "Eddy Current Micro-Sensors for Flaw Imaging," Monitoring Technology For Condition-Based Maintenance, R. Cowan, ed., ASME Paper No. 96-TRIB-66, pp. 25-31.