Localized electrochemical plating of interconnectors for microelectronics

IEEE WESCANEX Communications, Power, and Computing

Volumn , Issue , 1997, Pages 327-332

  El Giar, E M ^a   Cairo, U ^a   Thomson, D J ^a  

^a UNIVERSITY OF MANITOBA   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER PLATING; ELECTRONICS PACKAGING; ELECTROPLATING SOLUTIONS; GLASS; MICROELECTRONICS; MICROSCOPES; SUBSTRATES;

INTERCONNECTORS; SCANNING ELECTROCHEMICAL MICROSCOPE (SECM);

ELECTRODEPOSITION;

EID: 0031356629     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (17)