Recent experiments on vacuum breakdown of oxygen-free copper electrodes

IEEE Transactions on Dielectrics and Electrical Insulation

Volumn 4, Issue 6, 1997, Pages 841-847

  Kobayashi, Shinichi ^a  

^a SAITAMA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; BUFFING; CLEANING; COPPER; CRYSTALLIZATION; DIAMONDS; ELECTRIC BREAKDOWN OF SOLIDS; ELECTRIC INSULATING COATINGS; ELECTRODES; RESIDUAL STRESSES; SPUTTERING; TURNING;

SPUTTER CLEANING; VACUUM BREAKDOWN; VACUUM INSULATION;

VACUUM APPLICATIONS;

EID: 0031356166     PISSN: 10709878     EISSN: None     Source Type: Journal    
DOI: 10.1109/94.654725     Document Type: Article

References (11)

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2. R. V. Latham, High Vltage Vacuum Insulation: The Physical Basis, Chapter 2, Academic Press, London, 1981.
3. R. V. Latham, High Voltage Vacuum Insulation: Basic Concepts and Technological Practice, Chapter 2, Academic Press, London, 1995.
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8. S. Kobayashi, Y. Saito, Y. Nagai and Y. Yamamoto, "Vacuum Breakdown Strength of Vacuum-degassed Oxygen-free Copper Electrodes", IEEE Trans. EI, Vol. 28, pp. 500-506 1993.
9. S. Kobayashi, Y. Saito, Y. Hashimoto and Y. Yamamoto, "Vacuum Breakdown Properties and Surface Conditions of Vacuum Degassed Oxygen Free Copper Electrodes", Proc. 8th Int. Symp. on FIV Engineering, edited by T. Kawamura, 1, 311 (Yokohama, 1993).
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11. S. Kobayashi, Y. Hashimoto, Y. Saito, Y. Nagai, Y. Yamamoto, K. Takeuchi and T. Sugano, "Vacuum Breakdown Properties of Oxygen-free Copper Electrodes Machined by Diamond Turning for Mirror Finish", SPIE, Vol. 2259, pp. 17-20, 1994.