|
|
|
Volumn 14, Issue 2, 1997, Pages 115-122
|
|
High-density interconnect and packaging - how to design and implement for products
a
a
NONE
|
|
Author keywords
[No Author keywords available]
|
|
Indexed keywords
ELECTRONICS PACKAGING;
MULTICHIP MODULES;
OPTICAL INTERCONNECTS;
PRINTED CIRCUIT BOARDS;
PRODUCT DESIGN;
SEMICONDUCTOR DEVICES;
SUBSTRATES;
HIGH DENSITY INTERCONNECTION;
PACKAGING TECHNOLOGY;
INTEGRATED CIRCUIT MANUFACTURE;
|
|
EID: 0031354284
PISSN: 13670476
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
|
Times cited : (2)
|
|
References (2)
|
