On the effect of nonlinear boundary conditions for heat conduction in diamond heat spreaders with temperature-dependent thermal conductivity

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 20, Issue 4, 1997, Pages 537-540

  Hui, Ping ^a   Tan, H S ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Diamond heat spreader; Microwave diode package; Temperature dependent thermal conductivity

Indexed keywords

BOUNDARY CONDITIONS; HEAT CONDUCTION; HEAT SINKS; INTERFACES (MATERIALS); THERMAL CONDUCTIVITY OF SOLIDS; THERMAL EFFECTS;

DIAMOMD HEAT SPREADERS; MICROWAVE DIODE PACKAGE;

SEMICONDUCTOR DEVICE TESTING;

EID: 0031352891     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.650945     Document Type: Article

References (10)

1. A. R. Batchelor, "Steady-state heat sink analysis for two-terminal microwave oscillator devices with temperature dependent thermal conductivity," Proc. R. Soc. Lond. A, 1993, vol. 441, pp. 181-189
2. A. R. Batchelor and V. Postoyalko, "Steady-state heat conduction analysis for two-terminal microwave oscillator devices with rectangular integral heat sinks," Proc. R. Soc. Lond. A, 1995, vol. 445, pp. 375-381.
3. F. Bonani and G. Ghione, "On the application of the Kirchhoff transformation to the steady-state thermal analysis of semiconductor devices with temperature-dependent and piecewise inhomogeneous thermal conductivity," Solid-State Electron., vol. 38, pp. 1409-1412, 1995.
4. J. Doting and J. Molenaar, "Isotherms in diamond heat sinks, nonlinear heat transfer in an excellent heat conductor," in Proc. IEEE Semi-Therm (4th Ann. Semiconductor Thermal Temp. Meas. Symp.), Piscataway, NJ, 1988, pp. 113-117.
5. W. B. Joyces, "Thermal resistance of heat sinks with temperature-dependent conductivity," Solid-State Electron., vol. 18, pp. 321-322, 1975,
6. P. Hui and H. S. Tan, "Temperature distributions in a heat dissipation system using a cylindrical diamond heat spreader on a copper heat sink," J. Appl. Phys., vol. 75, pp. 748-757, 1994.
7. J. F. Luy and J. Schmidel, "Temperature distribution in cylinder symmetric mm-wave devices," IEEE Microwave Theory Technol., vol. 42, pp. 573-579, Apr. 1994.
8. P. Hui, C. P. Tso, and H. S. Tan, "Diamond heat spreaders with temperature-dependent thermal conductivity for microwave power devices," Jpn. J. Appl. Phys., vol. 35, pp. 5795-5804, 1996.
9. E. A. Burgemeister, "Thermal conductivity of natural diamond between 320 and 450 K," Physica B, vol. 93, pp. 165-179, 1978.
10. P. Hui, H.S. Tan, and Y.S. Lye, "Design of circular heat spreaders on semi-infinite heat sinks in microelectronics device applications," in Proc. IEEE 13th Ann. Semi-Therm Symp. Austin, TX, Jan. 28-30, 1997, pp. 231-237.