Thermal modeling of micro-hotplates for integrated sensor applications

Proceedings of the IEEE Hong Kong Electron Devices Meeting

Volumn , Issue , 1997, Pages 149-152

  Wong, Darwin T W ^a   Chan, Philip C H ^a   Sheng, Lie yi ^a   Sin, Johnny K O ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; CHEMICAL SENSORS; COMPUTER SIMULATION; ETCHING; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; MICROMACHINING; SEMICONDUCTING SILICON;

MICROMACHINED MICRO HOTPLATES;

MICROELECTRONICS;

EID: 0031348568     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)