Analysis of interconnect and package structures using PEEC models with radiated emissions

IEEE International Symposium on Electromagnetic Compatibility

Volumn , Issue , 1997, Pages 353-358

  Pinello, W ^a   Ruehli, Albert ^a   Cangellaris, A ^a  

^a UNIVERSITY OF ARIZONA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTROMAGNETIC FIELDS; ELECTROMAGNETIC WAVE EMISSION; ELECTROMAGNETIC WAVE INTERFERENCE; ELECTRONICS PACKAGING; FREQUENCY DOMAIN ANALYSIS; MATHEMATICAL MODELS; TIME DOMAIN ANALYSIS;

ELECTRICAL INTERCONNECT AND PACKAGE (EIP); PARTIAL ELEMENT EQUIVALENT CIRCUIT (PEEC) TECHNIQUE;

EQUIVALENT CIRCUITS;

EID: 0031344548     PISSN: 01901494     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (16)