Thermal/EMC optimization of airborne electronic racks

Proceedings of the International Systems Packaging Symposium

Volumn , Issue , 1997, Pages 156-168

  Assouad, Yannick ^a   Etienne, Philippe ^a   Labaune, Gerard ^a  

^a THALES   (France)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; ELECTROMAGNETIC COMPATIBILITY; PRINTED CIRCUIT BOARDS;

AIRBORNE ELECTRONIC RACKS;

ELECTRONICS PACKAGING;

EID: 0031344018     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)