Conjugate heat transfer with buoyancy effects from micro-chip sized repeated heaters

Journal of Electronic Packaging, Transactions of the ASME

Volumn 119, Issue 4, 1997, Pages 275-280

  Yu, D ^a   Ameeel, T A ^b   Warrington, R O ^b   Barron, R F ^b  

^a Input Output Inc   (United States)

^b LOUISIANA TECH UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BUOYANCY; FINITE ELEMENT METHOD; HEAT CONVECTION; LAMINAR FLOW; MATHEMATICAL MODELS; PRINTED CIRCUIT BOARDS; SURFACE MOUNT TECHNOLOGY; THERMAL CONDUCTIVITY OF SOLIDS;

MICROCHIP SIZED HEATERS;

MICROPROCESSOR CHIPS;

EID: 0031343278     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792249     Document Type: Article

References (15)

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