Residual stress analysis of bimaterial strips under multiple thermal loading

Journal of Electronic Packaging, Transactions of the ASME

Volumn 119, Issue 4, 1997, Pages 281-287

  Tierney, J W ^a   Eischen, J W ^a  

^a North Carolina State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTOPLASTICITY; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; MULTILAYERS; RESIDUAL STRESSES; STRESS ANALYSIS; STRESS CONCENTRATION; THERMAL STRESS;

BIMATERIAL STRIPS;

ELECTRONICS PACKAGING;

EID: 0031342783     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792250     Document Type: Article

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