Survey of model reduction techniques for analysis of package and interconnect models of high-speed designs

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 1997, Pages 251-254

  Chiprout, Eli ^a   Nguyen, Tuyen ^a  

^a IBM AUSTIN RESEARCH LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL METHODS; COMPUTER SIMULATION; MAXWELL EQUATIONS;

MODEL REDUCTION TECHNIQUES;

ELECTRONICS PACKAGING;

EID: 0031341353     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)