Understanding the impact of batch vs. single wafer in thermal processing using cost of ownership analysis

Materials Research Society Symposium - Proceedings

Volumn 470, Issue , 1997, Pages 201-206

  Hossain Pas, S ^a   Pas, M F ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; CHEMICAL VAPOR DEPOSITION; COST ACCOUNTING; DENSIFICATION; OXIDATION; SEMICONDUCTING SILICON; SINTERING;

COST OF OWNERSHIP (COO) ANALYSIS; RAPID THERMAL PROCESSING;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0031340418     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-470-201     Document Type: Conference Paper

References (3)