Boiling heat transfer from a micro heater

American Society of Mechanical Engineers, Dynamic Systems and Control Division (Publication) DSC

Volumn 62, Issue , 1997, Pages 135-142

  Hijikata, Kunio ^a   Yamamoto, Norihiko ^a   Takagi, Shu ^a  

^a TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; BOILING LIQUIDS; COOLANTS; GLASS; HEAT CONDUCTION; HEATING EQUIPMENT; INDIUM COMPOUNDS; SUBSTRATES;

MICROHEATERS;

MICROELECTROMECHANICAL DEVICES;

EID: 0031340005     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (7)

1. Baker, E., 1972, "Liquid Cooling of Microelectronic Devices by Free and Forced Convection", Microelectronics and Reliability, Vol.11, pp.213-222.
2. Fujii,T., 1974, "The progress of Thermal Engineering", Yokenndo,Japanese.
3. Fujii,T.,et al, 1973, "International Journal of Heat and Mass Transfer",Vol. 16, p.611-.
4. Guo, Z., and El-Genk, M., 1994, "Liquid microlayer evaporation during nucleate boiling on the surface of a flat composite wall", Int.J. Heat and Mass Transfer, Vol.37, pp.1641-1655
5. Koffman, L.D. and Plesset, M.S., 1983, "Experimental Observations of the Microlayer in Vapor Bubble Growth on a Heated Solid", J. Heat Transfer, Vol.105, pp.625-632
6. Isshiki, N. at el. ,1965, "Boiling Heat Transfer", JSME,Japanese
7. Nagasaki, T., Hijikata, K., Fushinobu, K., and Saitoh, T., 1993, "Boiling Heat Transfer from a Small Heating Element", ASME HTD-Vol. 262, Winter Annual Meeting, (New Orleans, LA, USA), pp. 65-73.