Comparison FEA study of the thermal performance of diamond substrates in face-up and flip-chip bonded electronic packaging applications

Proceedings of the International Systems Packaging Symposium

Volumn , Issue , 1997, Pages 129-134

  Brown, M D ^a   Malshe, A P ^a   Gordon, M H ^a   Ulrich, R K ^a   Schmidt, W F ^a   Brown, W D ^a  

^a UNIVERSITY OF ARKANSAS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; DIAMONDS; DIES; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; MATHEMATICAL MODELS; SOLDERING; SUBSTRATES; THERMAL CONDUCTIVITY OF SOLIDS;

FACE UP SINGLE CHIP PACKAGES; THERMAL MANAGEMENT;

ELECTRONICS PACKAGING;

EID: 0031338727     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)