Behaviors of precipitates, voids, and hillocks in electromigration stressed Al-2wt%Cu interconnects

Materials Research Society Symposium - Proceedings

Volumn 473, Issue , 1997, Pages 357-362

  Grosjean, D E ^a   Okabayashi, H ^a   Komatsu, M ^a   Mori, H ^a  

^a NEC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM ALLOYS; ANODES; CATHODES; ELECTROMIGRATION; STRESSES; TITANIUM NITRIDE; TRANSMISSION ELECTRON MICROSCOPY;

HILLOCK GROWTH; VOID GROWTH;

INTEGRATED CIRCUITS;

EID: 0031338292     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-473-357     Document Type: Conference Paper

References (14)