MCM-C cost comparison: Fodel vs. Diffusion PatterningTM vs. Green TapeTM

Proceedings of SPIE - The International Society for Optical Engineering

Volumn , Issue , 1997, Pages 53-58

  Page, J ^a   Amey, D I ^a   Draudt, R ^a   Inman, M ^a   Horowitz, S J ^a  

^a DUPONT COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; COST ACCOUNTING; COST EFFECTIVENESS; SENSITIVITY ANALYSIS; THICK FILM CIRCUITS;

TECHNICAL COST MODELING (TCM);

MULTICHIP MODULES;

EID: 0031336280     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)