Simulation of mold filling of liquid-solid mixture

TMS Annual Meeting

Volumn , Issue , 1997, Pages 719-724

  Ohnaka, I ^a   Sugiyama, A ^a   Zhu, J D ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOYS; COMPUTER SIMULATION; FILLING; FLOW OF FLUIDS; MIXTURES; SOLIDS; VISCOSITY; WATER;

MOLD FILLING; ONE PHASE FLOW; SEMISOLID ALLOYS;

METAL MOLDING;

EID: 0031335933     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)