Evaluation of glob top and underfill encapsulated active and passive structures for millimeter wave applications

1997 27th European Microwave Conference, EuMC 1997

Volumn 1, Issue , 1997, Pages 26-31

  Baumann, G ^a   Muller, E ^a   Buchali, F ^a   Ferling, D ^a   Richter, H ^a   Heinrich, W ^b  

^a NOKIA RESEARCH CENTER   (United States)

^b LEIBNIZ INSTITUT FÜR HÖCHSTFREQUENZTECHNIK   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; ELECTRIC LINES; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; PARAMETER EXTRACTION; TRANSMISSION LINE THEORY; WIRE; COST EFFECTIVENESS; ELECTRONICS PACKAGING; ENCAPSULATION; EPOXY RESINS; EQUIVALENT CIRCUITS; FLIP CHIP DEVICES; HIGH ELECTRON MOBILITY TRANSISTORS; HIGH FREQUENCY TELECOMMUNICATION LINES; MESFET DEVICES; MICROWAVE DEVICES;

ACTIVE AND PASSIVE DEVICE; ENVIRONMENTAL INFLUENCES; EPOXY ENCAPSULATION; EQUIVALENT ELECTRICAL CIRCUITS; MILLIMETER-WAVE APPLICATIONS; MODIFIED PARAMETERS; PARAMETER-EXTRACTION METHOD; UNDERFILL ENCAPSULATION;

FLIP CHIP DEVICES; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

GLOB TOP ENCAPSULATION; RADIO FREQUENCY TRANSMISSION LINES;

EID: 0031335872     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EUMA.1997.337765     Document Type: Conference Paper

References (7)

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