Mixed mode fracture in electronic packages

Materials Research Society Symposium - Proceedings

Volumn 445, Issue , 1997, Pages 263-268

  Soboyejo, W O ^a   Sinha, V ^a   Kenner, V ^a  

^a OHIO STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; EPOXY RESINS; FRACTURE TOUGHNESS; PLASTICS FILLERS; SILICA; STRESSES; THERMAL EFFECTS; TRANSMISSION ELECTRON MICROSCOPY;

MIXED MODE FRACTURE TOUGHNESS;

SHEET MOLDING COMPOUNDS;

EID: 0031335424     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)