Processing and characterization of hybrid silica-based xerogel films

Materials Research Society Symposium - Proceedings

Volumn 476, Issue , 1997, Pages 105-110

  Chow, Loren A ^a   Yu, Ted ^a   Dunn, Bruce S ^a   Tu, K N ^a   Chiang, Chien ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CURING; CURRENT VOLTAGE CHARACTERISTICS; DESORPTION; ELECTRIC BREAKDOWN OF SOLIDS; MOISTURE; PERMITTIVITY; POROUS SILICON; SILANES; SILICA GEL;

DIMETHOXYDIMETHYLSILANE; METHYLTRIMETHOXYSILANE; TETRAMETHOXYSILANE; XEROGEL FILMS;

DIELECTRIC FILMS;

EID: 0031335003     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-476-105     Document Type: Conference Paper

References (3)