ViperBGA: A novel design approach to high performance and high density BGA's

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1997, Pages 386-390

  Wu, Paul ^a   Chen, Kevin ^a   Tzou, Jerry ^a   Nachnani, Manoj ^a  

^a ProLinx Labs Corp   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER AIDED DESIGN; COMPUTER SIMULATION; COMPUTER SOFTWARE; COST EFFECTIVENESS; ELECTRIC VARIABLES MEASUREMENT; FINITE ELEMENT METHOD; INTEGRATED CIRCUIT LAYOUT; SUBSTRATES; THERMAL VARIABLES MEASUREMENT;

BALL GRID ARRAYS (BGA); SOFTWARE PACKAGE VIPERBGA;

ELECTRONICS PACKAGING;

EID: 0031334734     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (1)