Multiwavelength DFB-LD array module using self-aligned solder bump bonding

IEE Conference Publication

Volumn , Issue 448 /2, 1997, Pages 212-215

  Suzuki, N ^a   Muroya, Y ^a   Sasaki, J ^a   Yamada, H ^a   Torikai, T ^a  

^a NEC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

DISTRIBUTED FEEDBACK LASERS; FLIP CHIP DEVICES; SOLDERING;

SELF ALIGNED SOLDER BUMP BONDING;

SEMICONDUCTOR LASERS;

EID: 0031333064     PISSN: 05379989     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)