Use of concentrated hydrogen peroxide for the removal of a TiW ARC from aluminum bond pads

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1997, Pages 99-104

  Danzl, Ralph B ^a   McLaurin, Allen ^a  

^a MEDTRONIC INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; BONDING; HYDROGEN PEROXIDE; METALLIZING; REACTIVE ION ETCHING; SCANNING ELECTRON MICROSCOPY; TITANIUM COMPOUNDS;

COMPOSITE METALLIZATION SCHEME; PAD MASKING MODULE; WIRE BONDING PROCESS;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0031332466     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)