New chip scale package with CTE matching to the board

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1997, Pages 205-215

  Schueller, R D ^a  

^a Electronic Products   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP DEVICES; MOLDING; PRINTED CIRCUIT BOARDS; SOLDERED JOINTS; SOLDERING; STRESSES; THERMAL EXPANSION;

CHIP SCALE PACKAGES;

ELECTRONICS PACKAGING;

EID: 0031332252     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (18)