Computational continuum modeling of solder interconnects

TMS Annual Meeting

Volumn , Issue , 1997, Pages 171-178

  Burchett, S N ^a   Neilsen, M K ^a   Frear, D R ^a   Stephens, J J ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; MICROSTRUCTURE; VISCOPLASTICITY;

LEADLESS CHIP CARRIER SOLDER INTERCONNECTS;

SOLDERING ALLOYS;

EID: 0031332169     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)