Recent advances in surface and thin film analysis methods for application to packaging problems

Proceedings of the Electronic Technology Conference, EPTC

Volumn , Issue , 1997, Pages 270-276

  von Criegern, Rolf ^a   Budde, Klaus ^a   Hoesler, Wolfgang ^a   Holzapfel, Winfried ^a  

^a SIEMENS AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

AUGER ELECTRON SPECTROSCOPY; CONTAMINATION; INTERFACES (MATERIALS); RUTHERFORD BACKSCATTERING SPECTROSCOPY; SECONDARY ION MASS SPECTROMETRY; SURFACE STRUCTURE; THIN FILMS; X RAY PHOTOELECTRON SPECTROSCOPY;

CHEMICAL STATE DEPTH PROFILING; MULTI-ELEMENT DEPTH PROFILING; SURFACE ANALYSIS METHODS;

ELECTRONICS PACKAGING;

EID: 0031326132     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)