Laminar flow through microchannels used for microscale cooling systems

Proceedings of the Electronic Technology Conference, EPTC

Volumn , Issue , 1997, Pages 119-122

  Jiang, X N ^a   Zhou, Z Y ^a   Huang, X Y ^a   Liu, C Y ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CHANNEL FLOW; COOLING SYSTEMS; HEAT TRANSFER; LAMINAR FLOW; MICROMACHINING; PIPE FLOW; REYNOLDS NUMBER; SILICON WAFERS; SURFACE ROUGHNESS; TURBULENT FLOW;

MICROCHANNELS; MICROSCALE COOLING SYSTEMS;

ELECTRONICS PACKAGING;

EID: 0031324967     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (16)