Comparison of component and system level thermal performance for various thermally enhanced packages and PCB layouts

Proceedings of the Electronic Technology Conference, EPTC

Volumn , Issue , 1997, Pages 69-74

  Berg, Mark J ^a   Dakuginow, Sambu ^a   Apides, Roland ^a   Lacap, Efren ^a  

^a SEAGATE TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COST EFFECTIVENESS; HEAT RESISTANCE; INTEGRATED CIRCUIT LAYOUT; MICROELECTRONICS; PRINTED CIRCUIT DESIGN; RELIABILITY; THERMOGRAPHY (TEMPERATURE MEASUREMENT);

THERMAL IMPEDANCE; THERMALLY ENHANCED MICROELECTRONICS PACKAGES;

ELECTRONICS PACKAGING;

EID: 0031321610     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)