Examination of some high-strength, high-conductivity copper alloys for high-temperature applications

Scripta Materialia

Volumn 38, Issue 2, 1997, Pages 199-205

  Dadras, M M ^a   Morris, D G ^a  

^a UNIVERSITY OF NEUCHÂTEL   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; CHEMISTRY; COALESCENCE; DIFFUSION; ELECTRIC CONDUCTIVITY; HIGH TEMPERATURE APPLICATIONS; INTERMETALLICS; RAPID SOLIDIFICATION; STABILITY; STRESSES; TENSILE STRENGTH; VOLUME FRACTION;

COARSENING; SECOND PHASE; TENSILE FLOW STRESS;

COPPER ALLOYS;

EID: 0031295855     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6462(97)00467-3     Document Type: Article

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