Thermal expansion and elastic moduli of the silicide based intermetallic alloys Ti5Si3(X) and Nb5Si3

Scripta Materialia

Volumn 38, Issue 2, 1997, Pages 307-313

  Zhang, Lanting ^a   Wu, Jiansheng ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITION REACTIONS; ALLOYING; ANISOTROPY; BONDING; CHROMIUM; ELASTIC MODULI; INTERMETALLICS; NIOBIUM; STRENGTHENING (METAL); THERMAL EXPANSION;

SILICIDE; THERMAL EXPANSION COEFFICIENT;

SILICON ALLOYS;

EID: 0031295736     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6462(97)00496-X     Document Type: Article

References (7)

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3. T. Nakashima and Y. Umakoshi, Philos. Mag. Letters. 66, 317 (1992).
4. A. J. Thom, M. Akinc, O. B. Cavin, and C. R. Hubbard, J. of Materials Science Letters. 13, 1657 (1994).
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7. Y. Kim, A. J. Thom, and M. Akinc, DE93004465.