Laser drilling of blind holes in FR4/glass

Circuit World

Volumn 24, Issue 1, 1997, Pages 45-49

  Owen, M ^a   Poelants, E ^b   Van Puymbroeck, J ^c  

^a ESI   (United States)

^b SIEMENS AG   (Germany)

^c Siemens LPT ^*  (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON DIOXIDE LASERS; DRILLING MACHINES (MACHINE TOOLS); GLASS; LASER APPLICATIONS; PHOTOLITHOGRAPHY; SOLID STATE LASERS;

LASER DRILLING MACHINES;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0031276269     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/030561201998000008     Document Type: Article

References (11)

1. US patents referenced: 4,642,160 (2/87), 5,227,013 (7/93), 4,789,770 (12/88), 4,644,130 (2/87) 5,010,232 (4/91).
2. Burgess, L.W., "Laser vias: today's answer to interconnect density" by NEPCON, 1984, pp. 289-97.
3. "ITI creates ultradense boards with laser-drilled vias", ESI Laser Pulse, Summer, 1987.
4. Arzigian, J., "Laser drilling of printed wiring boards: final report of work sponsored by Sandia LDRD program", May 1994.
5. Kestenbaum, A., Amico, J.F.D., Blumenstock, B. and Deangelo, M.A. "Laser drilling of microvias in epoxy-glass printed circuit boards", IEEE Transactions on components, Hybrids, ad Manufacturing Technology, Vol. 13 No. 4, December 1990, pp. 1055-62.
6. Watson, M.N., "Laser drilling of printed circuit boards", Circuit World, Vol. 11 No. 1, 1984, pp. 13-29.
7. Personal communication with Dr Nakahara, January 1997.
8. Bachmann, F., "Excimer lasers in a fabrication line for a highly integrated printed circuit board", Chemtronics, Vol. 4. September, 1989, pp. 149-52.
9. Personal communication with Francis (Bo) Burns regarding IBM via drilling experiences. November 1996.
10. Owen, M., "New laser technology for drilling through and Blind vias in copper clad reinforced circuit boards", IPC Proceedings. May 1995.
11. Owen, M., Moser, D., Bleiweiss, H., Van Puymbroeck, E. Roelants, E. and Mattelin, A., "The Introduction of UV Nd:YAG laser drilled microvias in PCBs", by Proceedings of PCWC, May 21-24,1996, Basel, Switzerland.