A low-cost chip size package - NuCSP

Circuit World

Volumn 24, Issue 1, 1997, Pages 34-38

  Chou, T ^a   Lau, J ^a  

^a Express Packaging Systems Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; BONDING; INTEGRATED CIRCUIT MANUFACTURE; SOLDERING;

LAND GRIS ARRAY (LGA) CHIPS; PLASTIC QUAD FLAT PACK (PQFP);

ELECTRONICS PACKAGING;

EID: 0031275198     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/030561201998000006     Document Type: Article

References (4)

1. Lau, H.J. and Pao, Y., Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assembly, 2nd ed., McGraw-Hill, New York, NY, 1997.
2. Crowley, R.T., Goodman, T.W. and Vardaman, E.J., Chip-Size Package Development, TechSearch Inc., Austin, TX, 1995.
3. ANSYS User's Manual 5.3, Swanson Analysis Systems, Inc., Houston, TX, 1996.
4. Chen, K.L., Lau, H.J. and Wu, F.H., Thermal Resistance and Thermal Warpage of Cavity-Down Plastic Ball Grill Array Packages, 96-WA/EEP-1, ASME WAM, 1996.