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Volumn 33, Issue 24, 1997, Pages 2065-2066

InP-based mixed device (HEMT/HBT) technology on planar substrate for high performance mixed-signal and optoelectronic circuits

Author keywords

Indium phosphide; Integrated optoelectronics

Indexed keywords

ETCHING; HETEROJUNCTION BIPOLAR TRANSISTORS; HIGH ELECTRON MOBILITY TRANSISTORS; MICROWAVE MEASUREMENT; MOLECULAR BEAM EPITAXY; SEMICONDUCTING INDIUM PHOSPHIDE; SEMICONDUCTOR DEVICE STRUCTURES; SUBSTRATES;

EID: 0031274544     PISSN: 00135194     EISSN: None     Source Type: Journal    
DOI: 10.1049/el:19971384     Document Type: Article
Times cited : (12)

References (6)
  • 5
    • 3042911896 scopus 로고    scopus 로고
    • High speed InP-based IC fabrication technology for both commercial and military system insertion
    • BROWN, J.J., SCHMITZ, A.E., LE, M., and HU, M.: 'High speed InP-based IC fabrication technology for both commercial and military system insertion'. MRS Spring Meeting Abstracts, 1997, pp. 65
    • (1997) MRS Spring Meeting Abstracts , pp. 65
    • Brown, J.J.1    Schmitz, A.E.2    Le, M.3    Hu, M.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.