3D UV-microforming: A low-cost new technology for surface micromachining

IEE Colloquium (Digest)

Volumn , Issue 81, 1997, Pages

  Qu, W ^a   Wenzel, C ^a   Drescher, K ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

PHOTORESISTS; ULTRAVIOLET RADIATION;

ULTRAVIOLET MICROFORMING;

MICROMACHINING;

EID: 0031274353     PISSN: 09633308     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (2)

1. E. W. Becker, W. Ehrfeld, P. Hagmann, A. Maner and D. Münchmeyer: "Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming and plastic moulding (LIGA Process)", Microelectronics Engineering, 4 (1986) 35.
2. R A Lawes: "3D microforming for Europractice manufacturing cluster 3", MST-news, May/June 1997,45.