Measurement of thermal expansion coefficients by electronic speckle pattern interferometry at high temperature

Journal of Materials Science Letters

Volumn 16, Issue 21, 1997, Pages 1753-1756

  Kim, K S ^a   Kim, J H ^a   Lee, J K ^a   Jarng, S S ^a  

^a Chosun University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CAMERAS; HIGH TEMPERATURE APPLICATIONS; INTERFEROMETRY; LASER BEAMS; NICKEL ALLOYS; OXIDATION; SPECKLE; THERMAL VARIABLES MEASUREMENT;

COLOR CAMERA; ELECTRONIC SPECKLE PATTERN INTERFEROMETRY (ESPI); MOIRE FRINGE; THERMAL EXPANSION COEFFICIENT;

THERMAL EXPANSION;

EID: 0031274296     PISSN: 02618028     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1018527525996     Document Type: Article

References (10)

1. C. A. SCIAMMARELLA, Exp. Mech. 22 (1982) 418.
2. J. M. BURCH and C. FORNO, Opt. Engng 21 (1982) 602.
3. O. J. LOKBERG, J. T. MALMO and G. A. SLETTEMOEN, Appl. Opt. 24 (1985) 62.
4. O. J. LOKBERG and J. T. MALMO, SPIE 661 (1986) 52.
5. I. YAMAGUCHI, Optica Acta 28 (1981) 1359.
6. K. S. KIM, PhD thesis, Hanyang University, Korea (1987).
7. I. YAMAGUCHI, J. Jpn NDE 32 (1983) 676.
8. J. A. LEENDERTZ, J. Phys. E, Sci. Instrum. 3 (1970) 214.
9. F. P. CHING, R. ANASTASI, J. BEATY and J. ADACHI, Appl. Opt. 19 (1975) 2191.
10. D. DENBY and J. A. LEENDERTZ, J. Strain Anal. 9 (1974) 17.