Y1Ba2Cu3O7-x multilayer structures with a thick SiO2 interlayer for multichip modules

Journal of Materials Research

Volumn 12, Issue 11, 1997, Pages 2947-2951

  Afonso, S ^a   Chen, K Y ^a   Xiong, Q ^a   Tang, Y Q ^a   Salamo, G J ^a   Chan, F T ^a   Cooksey, J ^b   Scott, S ^b   Shi, Y J ^b   Ang, S ^b   Brown, W D ^b   Schaper, L W ^b  

^a UNIVERSITY OF ARKANSAS   (United States)

^b University of Arkansas   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; DEPOSITION; DIFFUSION IN SOLIDS; HIGH TEMPERATURE SUPERCONDUCTORS; MULTICHIP MODULES; OXIDE SUPERCONDUCTORS; OXYGEN; PERMITTIVITY; SILICA; SINGLE CRYSTALS; STRESS RELAXATION; YTTRIUM COMPOUNDS;

YTTRIA STABILIZED ZIRCONIA; YTTRIUM BARIUM COPPER OXIDE;

SUPERCONDUCTING FILMS;

EID: 0031272716     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.1997.0389     Document Type: Article

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